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王凌云

姓名:王凌云

职称/职务:教授/博士生导师;厦门市双百人才,厦门市重点人才,厦门市微机电研究会副理事

研究方向:微纳制造技术与装备;MEMS器件设计与开发;传感器封装与集成关键技术等

办公地点:厦门大学翔安校区 航空航天大楼223

邮箱:wangly@xmu.edu.cn

教育背景

2004/09-2009/12,厦门大学,机电工程系,硕博连读,获测试计量技术与仪器专业博士学位

1997/09-2001/07,厦门大学,机电工程系,获测控技术与仪器专业工学学士

教学工作

1.《电子技术》(本科生)

2.《机械工程测试技术基础》(本科生)

3.《传感器原理及应用》(本科生)

4.《微纳机电系统设计与工艺》(研究生)

5.《集成电路设计基础》(本科生)

6.《工业4.0与智能制造》(全校本科生大类通识课程)

研究领域

主要研究方向有:

1)MEMS器件设计及关键工艺开发;

2)MEMS器件集成封装及功能测试;

3)现代或极端环境用传感器开发设计及功能应用;

4)基于气浮、静电、压电喷射的微纳制造技术及装备开发;

5)高温薄膜传感器设计及其工艺开发。

近期发表文章

[1]Bu, Zhenxiang; Liu, Lujiang; Zhong, Changzhi; Wang, Shiqi; Gu, Dandan; Wang, Lingyun*. An Innovative LC-C Resonant Pressure Sensor Based on Capacitive Feedthroughs. IEEE Sensors Journal, 1530-437X, 2021-09-15.

[2]Yuchao Zhu; Lingke Yu; Dezhi Wu; Wenlong Lv; Lingyun Wang. A high-sensitivity graphene ammonia sensor via aerosol jet printing. Sensors and Actuators A Physical, 318 (2021) 112434.

[3]Lingyun Wang,Daner Chen,Heng Xiong,Yifang Liu. "Design and Optimization of Glass Frit Package Structure for Micro Pressure Switch." 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) IEEE, 2021.

[4]Yifang Liu,Hongbo Sang,Zhenxiang Bu,Yulong Zhang,Lingyun Wang*. "Influence of the Particle Size of Glass Powder on Sintering Characteristics in TGV Packaging." 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) IEEE, 2021.

[5]Huang, Xiang; Jin, Hang; Lin, Siying; Bu, Zhenxiang; Lin, Zhihong; Tu, Wenchang; Wang, Lingyun*; Adaptive electrofluid-actuated liquid lens, Optics Letters, 2020, 45(2):331-334.

[6]Xiang Huang, Siying Lin, Zhenxiang Bu, Wang, Lingyun*. Research on nozzle and needle combination for high frequency piezostack-driven dispenser. International Journal of Adhesive and Adhesives , 2020:102453.

[7]Wang, Lingyun*; Huang, Xiang; Lin, Siying; Bu, Zhenxiang; Jin, Hang; Lin, Xiaolong; Lin, Zhihong; Xie, Peiqin; Design and experiment of a jetting dispenser with compact amplifying mechanism and low stress in piezostack, Journal of Intelligent Material Systems and Structures, 2020, 31(5):788-798.

[8]Siying, Lin; Xiang, Huang; Dandan, Gu; Wenlong, Lv; Lingyun, Wang*; Investigation on Nickel-Based Nano-Scaffold Getter With Induction Heating and Rapid Activation, IEEE Transactions on Nanotechnology, 2020, 19:67-70.

[9]Huang, Xiang; Lin, Xiaolong; Jin, Hang; Lin, Siying; Wang, Lingyun*; Effect of Enhanced Squeezing Needle Structure on the Jetting Performance of a Piezostack-Driven Dispenser, Micromachines, 2019, 10(12):0-850.

[10]Bu, Z., Lin, S., Huang, X., Li, A., Wu, D., Zhao, Y., Luo Z., &  Wang, L.*.. A novel piezostack-driven jetting dispenser with corner-filleted flexure hinge and high-frequency performance.  Journal of Micromechanics & Microengineering, 2018,28(7),075001.

[11]Wang, L., Du, X., Wang, L.*, Xu, Z., Zhang, C., & Gu, D. (2017). High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor. Sensors, 17(3), 599.

[12]Zhan, Z., Li, W., Yu, L., Wang, L.*, & Sun, D. (2017). Study of Thermal Electrical Modified Etching for Glass and Its Application in Structure Etching. Materials, 10(2), 158.

[13]Du, X., Wang, L., Li, A., Wang, L.*, & Sun, D*. (2017). High Accuracy Resonant Pressure Sensor With Balanced-Mass DETF Resonator and Twinborn Diaphragms. Journal of Microelectromechanical Systems, 26(1), 235-245.

[14]Li, A., Zhang, C., Wang, H., He, Y., Sun, D., Wang, L.*, ... & Gu, D*. (2017). Design of temperature-immunization system packaging for the resonant pressure sensor. Modern Physics Letters B, 31(08), 1750085.

[15]Mahmoodi, S., Guoqing, H., Wang, L., & Nourikhajavi, M. (2017). Two-dimensional spin coating technology and the effect of artificial gravity on film’s air-bubbling. Microsystem Technologies, 23(5), 1585-1594.

[16]Wu, D., Xiao, Z., Deng, L., Sun, Y., Tan, Q., Dong, L.,  Wang, L*,  & Zhao, Y. (2016). Enhanced Deposition Uniformity via an Auxiliary Electrode in Massive Electrospinning. Nanomaterials, 6(7), 135.

[17]Yifang, L., Daner, C., Liwei, L., Gaofeng, Z., Jianyi, Z., Lingyun, W*., & Daoheng, S.* (2016). Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure. Journal of Micromechanics and Microengineering, 26(3), 035018.

[18]Luo, Z., Zheng, G., & Wang, L.* (2016). A Study on the Influence of the Nozzle Lead Angle on the Performance of Liquid Metal Electromagnetic Micro-Jetting. Micromachines, 7(12), 220.

[19]Zheng, C., Li, W., Li, A. L., Zhan, Z., Wang, L. Y*., & Sun, D. H. (2016). Design and Manufacturing of a Passive Pressure Sensor Based on LC Resonance. Micromachines, 7(5), 87.

[20]Du, X., Liu, Y., Li, A., Zhou, Z., Sun, D., & Wang, L*. (2016). Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams. Sensors, 16(2), 158

发明专利

(1)王凌云,蔡建法,李益盼,何勇,杜晓辉,王小萍. 一种喷射点胶头,2015.05.27,中国,ZL201310073952.1

(2)王凌云,陈梦月,梁楚尉,蔡建法,周如海,杜晓辉. 可加热自动对心匀胶机, 2015.05.13,ZL201310263210.5

(3)王凌云,王申,张豪尔,杜晓辉,蔡建法,占瞻,孙道恒. 一种重掺杂硼硅片的再分布方法,2015.04.01,中国,ZL201310074216.8

(4)王凌云,吕文龙,杜晓辉,苏源哲,占瞻,左文佳,孙道恒. 一种微器件的真空封装方法,2015.02.18,中国,ZL201210025120.8

(5)王凌云,杜晓辉,邱小椿,何杰,何广奇,李益盼,孙道恒. 一种硅微谐振式压力传感器及其制作方法,2014.08.27,中国,ZL201210282401.1

(6)王凌云,苏源哲,杜晓辉,占瞻,孙道恒,一种基于纳米压电纤维的压力传感器,2013.07.24,中国,ZL201110343031.3

(7)王凌云,孙道恒,杜江,吴德志,吕文龙,刘益芳. 可起停控制的电纺直写喷头. 发明专利,专利号:ZL201010611543.9.

(8)王凌云,江毅文,杜江,吕文龙,张弛,邹建男,孙道恒. 一种全对称硅微谐振式压力传感器.发明专利,专利号:Zl201010611298.1.

(9)王凌云,席凯伦,杨争雄,左文佳,孙道恒。 一种用于研磨抛光的晶圆粘片机. 实用新型. 专利号:ZL201220224588.5.

(10)王凌云,杜晓辉,占瞻,左文佳,苏源哲,吕文龙,孙道恒。 一种基于智能调温断电保护的电烙铁座. 实用新型. 专利号:ZL201220031307.4.

科研项目

1. 企业委托项目:X/Y MEMS轴陀螺开发,2021.08-2022.12,在研。

2. 企业委托项目:MEMS压阻式压力传感器敏感芯片开发及工艺流片,2021.10-2022.06,在研。

3. 企业委托项目:MEMS高精度谐振式压力传感器敏感芯片的设计与开发,2021.11-2022.06,在研。

4. 国家自然科学基金面上项目,61674125,面向MEMS封装的多孔纳米支架基吸气剂的构效关系及能控吸气行为研究,2017/01-2020/12,结题,主持。

5. 福建省科技计划重大项目,2015H6022,高速高黏度精密喷射点胶系统的产业化研发,2015/04-2018/04,结题,主持。

6. 福建省卫生教育联合攻关项目“辅助主动脉夹层诊治的3D打印血管建模及流体力学研究”,结题,主持。

7. 国家青年科学基金项目“近场电纺纳米纤维物理性能的诱变机制与行为规律”(项目编号:51105320),项目主持人,结题。

8. 厦门大学‘中央高校基本科研业务费专项资金’项目“精密喷射点胶头的研发”(项目编号:2010121039),项目主持人,结题。

9. 企业合作项目:硅谐振压力芯体工程化技术开发,2019.07-2021.05,结题。

10. 企业合作项目:硅MEMS谐振式压力传感器设计仿真与三层键合,2019.02-2019.11,结题。

11. 企业合作项目:助熔断剂按需喷射压电阀开发,2019.11-2019.12,结题。

12. 企业合作项目:BMS上位机软件系统开发,2018.8-2019.2,结题。

13. 企业合作项目:硅压阻式压力传感器设计/工艺研发,2017.12-2018.12,结题。

14. 企业合作项目:高温剪应力传感器的设计与关键工艺,2017.12-2018.06,结题。

15. 企业合作项目:SiC基典型微工艺研究,2017.12-2018.11,结题。